"WITH LOVE ..."

"WITH LOVE ..."
deadline extended

Amsterdam (The Netherlands) - The International student award for new forms of gift packaging has received numerous requests to extend the deadline for submissions for the "WITH LOVE ..." competition in order to align better with the end of semester dates of many design schools.
We therefore extend the deadline for submissions to 30 June 2008. Accordingly the pre-registration will close at 15 June 2008.

"With LOVE ..." is the title of the first international (gift) packaging competition, and has been announced by Stewo AG, in cooperation with :output foundation. Students of architecture, product design and communication design are invited to develop novel, surprising and innovative gift packaging solutions involving integrated concepts and objects which focus on the issue of ‘giving’, ‘packaging’ and ‘presentation’.

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